Ansys Multiphysics for Semiconductor

Duration : 1 Day

Ansys Multiphysics for Semiconductor

Date & Time: 13th Nov 2025 & 09:00 AM- 05:00 PM

Location: Advanced Semiconductor Academy of Malaysia, Level 2, South Wing, CoPlace9, Block 2320, Century Square, Jalan Usahawan, Off, Persiaran Multimedia, 63000 Cyberjaya, Selangor

Course Overview

This one-day professional training introduces participants to structural, thermal, and electrical analysis using ANSYS tools — with emphasis on semiconductor and electronic system applications. The program blends theoretical fundamentals with practical demonstrations using HFSS-IC, Icepak, Mechanical, and SIwave tools, complemented by a quick overview of Redhawk and Totem for chip-level power and reliability analysis.

Pre Requisites

Basic understanding of electronics fundamentals such as voltage, current, resistance, and circuit behavior.
Familiarity with semiconductor concepts — diodes, transistors, ICs, and fabrication basics.
Awareness of chip design and packaging terminology (e.g., die, substrate, interconnects, vias).
Prior exposure to simulation or CAD tools is beneficial but not mandatory.
Understanding of electromagnetic principles and their relevance to chip and system design.
Basic knowledge of thermal and mechanical aspects in electronic systems (optional but useful).
Interest in learning EDA (Electronic Design Automation) workflows and system-level analysis.

Training Objective

The objective of this training is to enhance participants’ understanding of semiconductor-oriented multiphysics simulation using ANSYS platforms, bridging the gap between device, package, and system-level design. The program emphasizes the practical application of simulation tools to address electrical, thermal, and mechanical performance challenges in advanced electronic systems.

Participants will gain exposure to chip-to-system design methodologies, including electromagnetic modeling using HFSS-IC, thermal and cooling optimization through Icepak, and structural reliability evaluation using Mechanical. In addition, the session introduces power integrity and reliability assessment workflows using Redhawk and Totem, essential for next-generation semiconductor design and verification.

The training aims to build a strong foundation in simulation-driven engineering, enabling participants to make informed design decisions, accelerate development cycles, and ensure product reliability across semiconductor and electronics domains.

Learning Outcomes

Understand the fundamentals of multiphysics simulation workflows for semiconductor and electronic systems.
Apply HFSS-IC, Icepak, Mechanical, and SIwave for electromagnetic, thermal, and structural analyses.
Interpret and correlate simulation data to evaluate design performance, reliability, and manufacturability.
Gain insight into chip–package–system co-design methodologies and thermal–electrical interactions.
Familiarize with Redhawk and Totem workflows for power integrity, EM/IR drop, and reliability analysis.
Strengthen their ability to make simulation-driven design decisions for optimized semiconductor product development.

Course Modules

Modules/Submodules		Timings
M1	Overview of Ansys Multiphysics for Semiconductor Applications • Introduction to multiphysics simulation workflow • Semiconductor design flow: chip, package, and system • Relevance of thermal, structural, and EM domains	09:00 AM – 10:30 AM
Break		10:30 AM – 11:00 AM
M2	Introduction to HFSS-IC and Chip–Package Co-Design Concepts • HFSS-IC environment and modeling setup • EM layout extraction and interconnect modeling • Chip-package coupling and signal path overvie	11:00 AM – 12:30 PM
W1	HFSS-IC – EM co-design and on-die interconnect analysis
Networking Lunch		12:30 PM – 01:30 PM
M3	Icepak – Thermal Modeling Overview • 3D geometry imports and power dissipation setup • Boundary conditions and meshing strategy • Steady-state and transient thermal evaluation • Coupling with HFSS/SIwave thermal maps • Analyzing hotspot distributions • Thermal management and cooling design optimization	01:30 PM – 03:00 PM
W1	Icepak – Thermal dissipation and airflow validation
	Break	03:00 PM – 03:30 PM
M4	Mechanical – Structural Deformation & Reliability Evaluation • Static and thermal stress simulations • Material and boundary setup for packaging • Warpage and solder joint reliability checks	03:30 PM – 04:00 PM
W3	Mechanical – Warpage and stress reliability evaluation